Ingram Micro Services is a division of an international conglomerate that provides, among other, service support for computer hardware manufacturers. Repairs, both under warranty and post-warranty, of IT equipment are carried out in facilities located near Wrocław. Our tasks in this project include creating EDI interfaces between the systems at Ingram Micro and the mentioned IT equipment manufacturer, as well as streamlining the production of packaging for the repaired equipment. The EDI interface work aims to automate the exchange of data related to service orders at all stages of the repair process: from receiving batches of devices requiring repair to preparing transport and returning the repaired devices to their manufacturer.
Regarding the packaging production process, the goal is also to automate data exchange, this time between SAP ECC and the machines used for producing cardboard boxes, and to have a more accurate cost control of materials and labor generated in the cardboard production.
Apart from this project, we are currently supporting Ingram Micro Services in two other areas: integrating the SAP ECC system with software supporting the management of purchasing documents and handling modifications to accounting and controlling processes.